Temperature range*: RT up to 200°C
-170°C up to 300°C
Sample thickness: From nm to µm range (depends on sample)
Measurement principle: Chip based (2 different kind of chips)
Deposition techniques: Include: PVD (sputtering, evaporation), CVD (ALD), Ink-Jet Printing and more
Measured parameters: Electrical Resistivity / Conductivity
Thermal Conductivity (3 Omega)
Specific Heat
Seebeck Coefficient
Optional: Hall Constant / Mobility / Charge carrier conc.
Electromagnet up to 1 T
Vacuum: up to 10E-5mbar
Electronics: Integrated
Interface: USB